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Binder for Chip Electronic Component

 

Binder is applied for Chip Electronic Component, e.g. Chip Ceramic Capacitor, Chip Inductor, Chip Ceramic Filter etc..

 

Characteristics:

Low burnout temperature

Low carbon impurity

Casting 2-50um tape on steel band or PET film

Product

Binder Solid (%)

Viscosity (NDJ-4  20-26℃)

Property

Application

BinderⅠ

34±2

3~8 kcp

Low burnout temperature, low carbon impurity, casting 2-50 um tape on the PET or steel band.

Tape Casting for Chip Resistor

Chip Ceramic Capacitor,

Chip Inductor

Chip Ceramic Filter etc.

Binder Ⅱ

26±2

3~7 kcp

LS Binder

34±2

3.5~7.5 kcp

Binder Ⅳ

25.5±2

1~9 kcp

HV Binder

20±1

1.5~8 kcp


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